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 MAX803SEXR Rev. A
RELIABILITY REPORT FOR MAX803SEXR PLASTIC ENCAPSULATED DEVICES
August 3, 2006
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by Jim Pedicord Quality Assurance Manager, Reliability Lab
Conclusion
The MAX803 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards.
Table of Contents I. ........Device Description V. ........Quality Assurance Information II. ........Manufacturing Information VI. .......Reliability Evaluation III. .......Packaging Information IV. .......Die Information .....Attachments I. Device Description A. General The MAX803 is a microprocessor (P) supervisory circuit used to monitor the power supplies in P and digital systems. It provides excellent circuit reliability and low cost by eliminating external components and adjustments when used with +5V, +3.3V, +3.0V, or +2.5V powered circuits. This circuit performs a single function: it asserts a reset signal whenever the VCC supply voltage declines below a preset threshold, keeping it asserted for at least 140ms after VCC has risen above the reset threshold. Reset thresholds suitable for operation with a variety of supply voltages are available. The MAX803 has an open-drain output stage. The MAX803's open-drain RESET-bar output requires a pull-up resistor that can be connected to a voltage higher than VCC. The MAX803 has an activelow RESET-bar output. The reset comparator is designed to ignore fast transients on VCC, and the outputs are guaranteed to be in the correct logic state for VCC down to 1V. Low supply current makes the MAX803 ideal for use in portable equipment. The MAX803 is available in a 3-pin SC70 package.
B. Absolute Maximum Ratings Item Terminal Voltage (with respect to GND) VCC RESET, RESET (push-pull) RESET (open drain) Input Current, VCC Output Current, RESET, RESET Rate of Rise, VCC Continuous Power Dissipation (TA = +70C) 3-Pin SC70 (derate 2.17mW/C above +70C) 3-Pin SOT23 (derate 4mW/C above +70C) Operating Temperature Range 3-Pin SC70 3-Pin SOT23 Storage Temperature Range Lead Temperature (soldering, 10s)
Rating
-0.3V to +6.0V -0.3V to (VCC + 0.3V) -0.3V to +6.0V 20mA 20mA 100V/s 174mW 320mW -40C to +125C -40C to +105C -65C to +150C +300C
II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: 3-Pin Microprocessor Reset Circuits B8 (Standard 0.8 micron silicon gate CMOS) 380 California, USA Malaysia January, 2000
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-C: 3-Pin SC70-3 Alloy 42 Solder Plate or 100% Matte Tin Nonconductive Epoxy Gold (1 mil dia.) Epoxy with silica filler # 05-1601-0082 Class UL94-V0
Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 30 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 0.8 microns (as drawn) 0.8 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Manager, Reliability Operations) Bryan Preeshl (Managing Director of QA) 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects.
B. Outgoing Inspection Level:
C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1= MTTF 1.83 (Chi square value for MTTF upper limit) 192 x 4340 x 160 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV = 6.87 x 10-9 = 6.87 F.I.T. (60% confidence level @ 25C)
This low failure rate represents data collected from Maxim's reliability monitor program. In addition to routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Attached Burn-In Schematic (Spec. #06-5033) shows the static Burn-In circuit. Maxim performs failure analysis on any lot that exceeds this reliability control level. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1N). Current monitor data for the B8/S8 Process results in a FIT rate of 0.17 @ 25C and 2.92 @ 55C (eV = 0.8, UCL = 60%).
B. Moisture Resistance Tests Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard 85C/85%RH testing is done per generic device/package family once a quarter. C. E.S.D. and Latch-Up Testing The MS42 die type has been found to have all pins able to withstand a transient pulse of 2500V, per Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 250mA.
Table 1 Reliability Evaluation Test Results MAX803SEXR
TEST ITEM
TEST CONDITION
FAILURE IDENTIFICATION
PACKAGE
SAMPLE SIZE
NUMBER OF FAILURES
Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs.
DC Parameters & functionality
160
0
DC Parameters & functionality
SC70
77
0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters & functionality 77 0
Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. b. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
c.
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKET
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B
TERMINAL D Mil Std 883D Method 3015.7 Notice 8
R = 1.5k C = 100pf
ONCE PER SOCKET
ONCE PER BOARD
100 OHMS
+5V 700uA
1 2 3 4
8 7 6 5
0.1uF
8-DIP
DEVICES: MAX 941/809/810/823/824/825/803 MAX 6381/6835 MAX. EXPECTED CURRENT = 700uA AND 15uA
DOCUMENT I.D. 06-5033 REVISION E
DRAWN BY: HAK TAN NOTES: 15 uA FOR MAX 6381
MAXIM TITLE: BI Circuit (MAX 6381/803/809/810/823/824/825/941/6835)
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